Display device

ABSTRACT

A display device includes a display panel and a touch sensing unit including touch signal lines (TSL) and sensor columns (SCs) including sensor blocks (SBs). Each SB includes a first sensor (FS) and i (i being ≥2) second sensors (SSs). The TSLs include: first signal lines (FSLs) respectively connected to some of the FSs, a portion of each of the FSLs extending to a first end of a corresponding SC from a corresponding sensor of the some of the FSs; second signal lines (SSLs) respectively connected to other FSs, a portion of each of the SSLs extending to a second end of the corresponding SC from a corresponding sensor of the other FSs; and third signal lines connecting a j-th (j being ≤1) SS of an n-th (n being ≥1) SB to an (i-j+1)-th SS of an (n+1)-th SB.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.16/272,264, filed Feb. 11, 2019, which is a continuation of U.S. patentapplication Ser. No. 15/192,939, filed Jun. 24, 2016, which issued asU.S. Pat. No. 10,234,982, and claims priority to and the benefit ofKorean Patent Application No. 10-2015-0154604, filed Nov. 4, 2015, eachof which is hereby incorporated by reference for all purposes as iffully set forth herein.

BACKGROUND Field

Exemplary embodiments relate to a display device, and, moreparticularly, to a display device including a touch sensing unit.

Discussion

Various display devices are used in association with multimedia devices,such as televisions, mobile phones, tablet computers, navigationalequipment, game consoles, etc. These multimedia devices may include aninput device to facilitate user interaction, such as keyboards, mice,etc. Additionally, display devices may include touch sensing units asinput devices.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventive concept,and, therefore, it may contain information that does not form the priorart that is already known to a person of ordinary skill in the art.

SUMMARY

One or more exemplary embodiments provide a display device including atouch sensing unit with improved sensitivity.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concept

According to one or more exemplary embodiments, a display deviceincludes a display panel configured to generate an image; and a touchsensing unit disposed on the display panel, the touch sensing unitincluding touch signal lines and sensor columns including sensor toblocks. Each of the sensor blocks includes: a first sensor; and i (ibeing a natural number greater than or equal to two) second sensorsarranged in a first direction. The touch signal lines include: firstsignal lines respectively connected to some of the first sensors, aportion of each of the first signal lines extending to a first end of acorresponding sensor column of the sensor columns from a correspondingsensor of the some of the first sensors; second signal linesrespectively is connected to other first sensors of the first sensors, aportion of each of the second signal lines extending to a second end ofthe corresponding sensor column of the sensor columns from acorresponding sensor of the other first sensors; and third signal linesconnecting a j-th (j being a natural number less than or equal to one)second sensor of the i second sensors of an n-th (n being a naturalnumber greater than or equal to one) sensor block of the sensor blocksto an (i-j+1)-th second sensor of the i second sensors of a (n+1)-thsensor block of the sensor blocks.

According to one or more exemplary embodiments, a display deviceincludes a display panel configured to generate an image; and a touchsensing unit disposed on the display panel, the touch sensing unitincluding touch signal lines and sensor columns. Each of the sensorcolumns includes sensor blocks arranged in a first direction. Each ofthe sensor blocks includes: a first sensor; and i (i being a naturalnumber greater than or equal to two) second sensors adjacent to thefirst sensor, the i second sensors being arranged in the firstdirection. The touch signal lines include: first signal lines connectedto the first sensors of the sensor blocks; and second signal linesconnecting a j-th (j being a natural number greater than or equal to oneand less than or equal to i) second sensor of the i second sensors of ann-th (n being a natural number greater than or equal to one) sensorblock of the sensor blocks to an (i-j+1)-th second sensor of the isecond sensors of an (n+1)-th sensor block of the sensor blocks. Thefirst sensor of the (n+1)-th sensor block includes: a first sensorportion; and a second sensor portion spaced apart to from the firstsensor portion in a second direction crossing the first direction. Afirst signal line of the first signal lines that is connected to thefirst sensor of the n-th sensor block is disposed between the firstsensor portion and the second sensor portion.

According to one or more exemplary embodiments, an external input may besensed using a touch sensing unit having a single-layer structure.Furthermore, a single-touch is and a multi-touch may be distinguishedfrom each other. Since the second sensors corresponding to differentsensor blocks from each other are electrically connected to each otherthrough a signal line, the number of the signal lines disposed on thetouch sensing unit may be reduced. In this manner, a potential forshort-circuits between the signal lines may be reduced. Moreover, noisecaused, at least in part, by the signal lines may be reduced, which mayimprove touch sensitivity.

According to one or more exemplary embodiments, among the signal linesconnected to the first sensors, a portion of the signal lines andanother portion of the signal lines extend in different directions fromeach other such that the number of signal lines disposed between thefirst sensor and the second sensors may be reduced. In this manner,noise exerting influence on capacitance formed between the first sensorand the second sensors may be reduced.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this to specification, illustrate exemplaryembodiments of the inventive concept, and, together with thedescription, serve to explain principles of the inventive concept.

FIG. 1 is a perspective view of a display device, according to one ormore exemplary embodiments.

FIG. 2 is an exploded perspective view of the display device of FIG. 1,according to one or more exemplary embodiments.

FIG. 3 is a cross-sectional view of the display device of FIG. 1 takenalong sectional line I-I′, according to one or more exemplaryembodiments.

FIG. 4 is an enlarged cross-sectional view of a touch sensing unit,according to one or more exemplary embodiments.

FIG. 5 is a plan view of the touch sensing unit of FIG. 4, according toone or more exemplary embodiments.

FIG. 6 is a plan view of a sensor block, according to one or moreexemplary embodiments.

FIG. 7A is an enlarged plan view of a touch sensing unit, according toone or more exemplary embodiments.

FIG. 7B is a plan view of two sensor blocks, according to one or moreexemplary embodiments.

FIG. 7C is a plan view of two sensor blocks, according to a comparativeexample.

FIG. 8 is an enlarged plan view of a second circuit board of the touchsensing unit of FIG. 5, according to one or more exemplary embodiments.

FIGS. 9A and 9B are block diagrams of a driving circuit of a touchsensing unit, according to one or more exemplary embodiments.

FIGS. 10A, 10B, 10C, and 10D are enlarged plan views of a touch sensingunit, according to one or more exemplary embodiments.

FIG. 11A is a plan view of a touch sensing unit, according to one ormore exemplary embodiments.

FIG. 11B is an enlarged plan view of the touch sensing unit of FIG. 11A,according to one or more exemplary embodiments.

FIG. 12A is a plan view of a touch sensing unit, according to one ormore exemplary embodiments.

FIG. 12B is an enlarged plan view of the touch sensing unit of FIG. 12A,according to one or more exemplary embodiments.

FIG. 13 is an enlarged cross-sectional view of a display panel,according to one or more exemplary embodiments.

FIG. 14 is a plan view of the display panel of FIG. 13, according to oneor more exemplary embodiments.

FIG. 15 is an equivalent circuit diagram of a pixel, according to one ormore exemplary embodiments.

FIG. 16 is a plan view of a touch sensing unit, according to o or moreexemplary embodiments.

FIG. 17 is an enlarged plan view of the touch sensing unit of FIG. 16,according to one or more exemplary embodiments.

FIG. 18 is an enlarged plan view of a first circuit board of the touchsensing unit of FIG. 17, according to one or more exemplary embodiments.

FIG. 19 is an enlarged plan view of a second circuit board of the touchsensing unit of FIG. 17, according to one or more exemplary embodiments.

FIG. 20 is a plan view of a touch sensing unit, according to one or moreexemplary embodiments.

FIG. 21 is an enlarged plan view of a circuit board, according to one ormore exemplary embodiments.

FIG. 22 is a plan view of a touch sensing unit, according to one or moreexemplary embodiments.

FIG. 23 is an enlarged plan view of a circuit board, according to one ormore exemplary embodiments.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order avoid unnecessarily obscuring various exemplaryembodiments.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail ofvarious exemplary embodiments. Therefore, unless otherwise specified,the features, components, modules, layers, films, panels, regions,and/or aspects of the various illustrations may be otherwise combined,separated, interchanged, and/or rearranged without departing from thedisclosed exemplary embodiments. Further, in the accompanying figures,the size and relative sizes of layers, films, to panels, regions, etc.,may be exaggerated for clarity and descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. Further, the DR1-axis, the DR2-axis, and theDR3-axis are not limited to three axes of a rectangular coordinatesystem, and may be interpreted in a broader sense. For example, theDR1-axis, the DR2-axis, and the DR3-axis may be perpendicular to oneanother, or may represent different directions that are notperpendicular to one another. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various elements, components, regions, layers, and/or sections,these elements, components, regions, layers, and/or sections should notbe limited by these terms. These terms are used to distinguish oneelement, component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed to below could betermed a second element, component, region, layer, and/or sectionwithout departing from the teachings of the present disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Moreover, although a layer (or other feature) may beillustrated as “flat,” the layer may not necessarily be required to beflat. To this end, a step difference may occur on a relatively upperlayer due to a surface shape of a relative lower layer during, forinstance, a stacking process. Thus, the regions illustrated in thedrawings are schematic in nature and their shapes are not intended toillustrate the actual shape of a region of a device and are not intendedto be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a perspective view of a display device, according to one ormore exemplary embodiments. FIG. 2 is an exploded perspective view ofthe display device of FIG. 1, according to one or more exemplaryembodiments. FIG. 3 is a cross-sectional view of the display device ofFIG. 1 taken along sectional line I-I′, according to one or moreexemplary embodiments. As will become more apparent below, a protectiveframe 200 of the display device DA of FIG. 1 is not shown in FIG. 3.

A display surface configured to display an image IM is parallel (orsubstantially parallel) to a surface defined by a first direction DR1and a second direction DR2. A third direction DR3 indicates a normaldirection of the display surface. The third direction DR3 indicates athickness direction of the display device DA. Front and rear surfaces ofeach member of the display device DA are distinguished by (or otherwisespaced apart from one another in) the third direction DR3. It is noted,however, that the directions indicated by the first, second, and thirddirections DR1, DR2, and DR3 are relative and may be converted intoother directions.

Although FIG. 1 illustrates a “flat” display device DA as arepresentative example, it is contemplated that exemplary embodimentsare not be limited thereto. For instance, the display device DA may be acurved display device with a determined curvature, a rollable displaydevice, a foldable display device, a flexible display device, etc.Although not shown separately, the display device DA may be used in orin association with small and medium-sized electronic devices, such asmobile phones, personal computers, notebook computers, tablets, personaldigital terminals, vehicle navigation units, game consoles, portableelectronic devices, wristwatch-type electronic devices, refrigerators,washers, dryers, etc., in addition to large-sized electronic devices,such as televisions, monitors, outdoor billboards, etc.

Referring to FIG. 1, the display device DA includes a plurality of areasdistinct from each other on the display surface. For instance, thedisplay device DA includes a display area DR in which the image IM isdisplayed, and a non-display area NDR adjacent to the display area DR.FIG. 1 illustrates an internet search window as a representative exampleof the image IM, but exemplary embodiments are not limited thereto. Asan example, the display area DR may have a quadrangular shape, but anyother suitable geometric configuration may be utilized in associationwith exemplary embodiments described herein. The non-display area NDRmay surround the display area DR. According to one or more exemplaryembodiments, the non-display area NDR may be disposed only in areasadjacent to the display area DR in the first direction DR1 or the seconddirection DR2, in which the areas face each other and the display areaDR is disposed therebetween. According to one or more exemplaryembodiments, the non-display area NDR may be omitted.

As shown in FIGS. 2 and 3, the display device DA includes a windowmember 100, a protective frame 200, a display panel 300, and a touchsensing unit 400. The display device DA includes a first circuit board300-F and a second circuit board 400-F that are respectively connectedto the display panel 300 and the touch sensing unit 400. At least one ofthe first and second circuit boards 300-F and 400-F may be, but is notlimited to, a flexible circuit board. The second circuit board 400-F mayinclude a driving circuit 400-IC mounted thereon. The driving circuit400-IC may drive the touch sensing unit 400 and may be, but is notlimited to, a driver integrated circuit (IC). Although not shown, adriving circuit, e.g., a driver IC, may be mounted on the first circuitboard 300-F to drive the display panel 300.

Each of the window member 100, the display panel 300, and the touchsensing unit 400 includes areas corresponding to the display area DR andthe non-display area NDR of the display device DA when viewed in a planview. In FIG. 3, widths in the first direction DR1 of the window member100, the display panel 300, and the touch sensing unit 400 are same eachother, but the widths of the window member 100, the display panel 300,and the touch sensing unit 400 may be selectively changed.

The window member 100 includes a base member 100-BS and a black matrixBM. The black matrix BM is disposed on a rear surface of the base member100-BS to define the non-display area NDR. The base member 100-BSincludes a glass substrate, a sapphire substrate, a plastic film, or thelike. The black matrix BM may be formed via a coating manner using acolored organic layer. Although not shown in figures, the window member100 may further include a functional coating layer disposed on a frontsurface of the base member 100-BS. The functional coating layer mayinclude an anti-fingerprint layer,an anti-glare layer, and a hardcoating layer.

The protective frame 200 is coupled to the window member 100 toaccommodate the display panel 300 and the touch sensing unit 400. Theprotective frame 200 may be formed by assembling a number of parts ormay be integrally formed in a single unitary and individual unit, whichmay be formed via an injection, compression, extrusion, etc., moldingprocess(es). The protective frame 200 may include a plastic or metalmaterial. According to one or more exemplary embodiments, the protectiveframe 200 may be omitted.

The display panel 300 generates the image IM corresponding to image dataapplied thereto. The display panel 300 may be a liquid crystal displaypanel, an organic light emitting display panel, or any other suitabledisplay panel. For descriptive convenience, an organic light emittingdisplay panel will be described as the display panel 300. The organiclight emitting display panel will be described in more detail later.

The touch sensing unit 400 obtains coordinate information of a positionat which a touch event occurs. The touch sensing unit 400 may be, but isnot limited to, an electrostatic capacitive type touch sensing unit. Thetouch sensing unit 400 will be described in snore later.

The window member 100 and the touch sensing unit 400 are coupled to eachother by a first optically clear adhesive film OCA1 and the touchsensing unit 400 and the display panel 300 are coupled to each other bya second optically clear adhesive film OCA2. One of the two opticallyclear adhesive films OCA1 and OCA2 may be omitted. For instance, whenthe display panel 300 and the touch sensing unit 400 are manufacturedthrough consecutive processes, the touch sensing unit 400 may bedirectly disposed on the display panel 300. In addition, the touchsensing unit 400 may be formed while the display panel 300 ismanufactured, and, as such, the touch sensing unit 400 may be integrallyformed with the display panel 300.

FIG. 4 is an enlarged cross-sectional view of a touch sensing unit,according to one or more exemplary embodiments. FIG. 5 is a plan view ofthe touch sensing unit of FIG. 4, according to one or more exemplaryembodiments. FIG. 6 is a plan view of a sensor block, according to oneor more exemplary embodiments. FIG. 7A is an enlarged plan view of atouch sensing unit, according to one or more exemplary embodiments. FIG.7B is a plan view of two sensor blocks, according to one or moreexemplary embodiments. FIG. 7C is a plan view of two sensor blocks,according to a comparative example. Hereinafter, the touch sensing unit400 will be described in more detail with reference to FIGS. 4 to 6 and7A to 7C.

Referring to FIG. 4, the touch sensing unit 400 includes a base member400-BS, a conductive layer 400-CL, and an insulating layer 400-IL.According to one or more exemplary embodiments, the touch sensing unit400 may be, but is not limited to, a single-layer electrostaticcapacitive type touch sensing unit. The single-layer electrostaticcapacitive type touch sensing unit obtains the coordinate informationabout the position, at which a touch (or near touch)event occurs, usinga self-capacitance manner or a mutual capacitance manner. The touchsensing unit 400, however, should not be limited to a single-layerelectrostatic capacitive type touch sensing unit. The touch sensing unit400 may be, but is not limited to, a multi-layer electrostaticcapacitive type touch sensing unit. In addition, the touch sensing unit400 may have different layer structures depending on the display area DRand the non-display area NDR. According to one or more exemplaryembodiments, the display area DR may have a single-layer structure andthe non-display area NDR may have a multi-layer structure. For instance,only one conductive layer may be disposed in the display area DR, and aplurality of conductive layers may be alternately stacked with aplurality of insulating layers in the non-display area NDR.

The conductive layer 400-CL may include at least one of a transparentconductive layer and a metal layer. The transparent conductive layer mayinclude indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide(ZnO), indium tin zinc oxide (ITZO), poly(3,4-ethylenedioxythiophne)(PEDOT), metal nanowire, or graphene. The metal layer may includemolybdenum, silver, titanium, copper, aluminum, or an alloy thereof.According to one or more exemplary embodiments, the conductive layer400-CL may include a plurality of transparent conductive layers or aplurality of conductive layers. The conductive layer 400-CL may includeat least one transparent conductive layer and at least one metal layer.The conductive layer 400-CL may have a mesh structure. For instance, aplurality of mesh holes may be defined through the conductive layer400-CL. According to one or more exemplary embodiments, the conductivelayer 400-CL may include nanowires manufactured using at least one ofthe above-mentioned metal materials.

The conductive layer 400-CL may include a plurality of conductivepatterns disposed on a surface of the base member 400-BS. The conductivepatterns form touch sensors and touch signal lines of the touch sensingunit 400 as described below. The touch sensors and the touch signallines may include the same material or different materials from eachother. The insulating layer 400-IL protects the conductive patterns. Theinsulating layer 400-IL includes an inorganic layer and/or an organiclayer. The insulating layer 400-IL may have a single-layer structure ora multi-layer structure.

As shown in FIG. 5, the touch sensing unit 400 includes sensor blocks SBdisposed in the display area DR. The touch signal lines connected to thesensor blocks SB are not shown in FIG. 5. The sensor blocks SB define aplurality of sensor columns TSC and/or a plurality of sensor rows TSL.FIG. 5 shows the sensor blocks SB arranged in a matrix form, butarrangements should not be limited thereto or thereby. The sensorcolumns TSC may include different numbers of sensor blocks SB, and thesensor rows TSL may include different numbers of sensor blocks SB. Thesensor columns TSC and/or the sensor rows TSL may be defined in adiagonal direction on the surface of the base member 400-BS. Each of thesensor blocks SB may include a first sensor RP and a plurality of secondsensors TP. FIG. 5 shows the sensor blocks SB including oneintegrated-type first sensor RP and three second sensors TP as arepresentative example.

The second circuit board 400-F is connected to the non-display area NDRof the touch sensing unit 400. The second circuit board 400-F has acircuit configuration that may be changed according to the configurationof the touch sensing unit 400. Although not shown in detail, the touchsensing unit 400 and the second circuit board 400-F are electricallyconnected to each other by an anisotropic conductive film (ACF).According to one or more exemplary embodiments, the anisotropicconductive film may be replaced with a solder bump.

Hereinafter, the sensor block SB will be described in detail withreference to FIG. 6. The sensor block SB include the first sensor RP andi (i being a natural number greater than or equal to 2) second sensorsTP1 to TPi disposed adjacent to the first sensor RP and arranged in adetermined direction, the second direction DR2. The i second sensors TP1to TPi form a sensor group TP-G. That is, i number of second sensors TP1to TPi form a sensor group TP-G. The number of the first sensors RPincluded in the sensor block SB may be determined based on the number ofthe first sensors RP electrically insulated from each other. Althoughthe sensor block SB includes two conductive patterns, two conductivepatterns electrically connected to is each other by a touch signal lineare referred to as one sensor. This is equally applicable to the secondsensor TP. That is, the i second sensors TP1 to TPi shown in FIG. 6 areelectrically insulated from each other. The direction in which thesecond sensors TP are arranged is not limited to a specific directionand may be the same as a direction in which the first sensor RP extends.The second sensors TP may be arranged in the second direction DR2 asshown in FIGS. 5 and 6, or in a direction in which the sensor column TSCextends as shown in FIG. 5.

FIG. 7A shows four sensor columns TSC1 to TSC4 each including foursensor blocks SB. For descriptive and illustrative convenience,reference numerals are assigned to a first sensor column TSC1.Hereinafter, the reference number of the sensor columns TSC1 to TSC4increases from a left column to a right column, the reference number ofthe sensor rows TSL1 to TSL4 increases from an upper row to a lower row,and the reference number of the sensors TP increases from an upperportion to a lower portion.

As shown in FIG. 7A, the touch signal lines include first signal linesSL1, second signal lines SL2, and third signal lines SL3. First pads PD1are respectively connected to first end of the first signal lines SL1and second pads PD2 are respectively connected to second ends of thesecond signal lines SL2. Third pads PD3 are respectively connected tosecond ends of the third signal lines SL3.

The first signal lines SL1 are respectively connected to the firstsensors RP of a to portion of the sensor blocks SB in the sensor columnTSC, and the second signal lines SL2 are respectively connected to thefirst sensors RP of another portion of the sensor blocks SB in the samesensor column TSC. Among the first signal lines SL1, one first signalline SL1-1 is connected to the first sensor RP of the first sensor blockSB and one first signal line SL1-2 is connected to the first sensor RPin a second sensor block SB. Among the second signal lines SL2, onesecond signal line SL2-1 is connected to the first sensor RP of a thirdsensor block SB and one second signal line SL2-2 is connected to thefirst sensor RP in a fourth sensor block SB,

At least a portion of each of the first signal lines SL1 extends in afirst end (e.g., an upper end in FIG. 7A) of a corresponding sensorcolumn TSC from a corresponding first sensor RP, and at least a portionof each of the second signal lines SL2 extends in a second end (e.g., alower end in FIG. 7A) of a corresponding sensor column TSC from acorresponding first sensor RP. For instance, each of the first signallines SL1 includes a first portion LP1 connected to the correspondingfirst sensor RP and extending in the first end of the correspond sensorcolumn TSC and a second portion LP2 connecting the first portion LP1 anda corresponding first pad PD1. The first portion LP1 of each of thefirst signal lines SL1 extends in the direction of the sensor column TSCand is not overlapped with the second signal lines SL2 in the directionof the sensor row TSL. The second portion LP2 of each of the firstsignal lines SL1 is disposed in the non-display area NDR. In thismanner, the second portion LP2 of each of the first signal lines SL1 isoverlapped with the black matrix BM shown in FIG. 3. The second portionLP2 of each of the first signal lines SL1 has a bent shape.

The first pads PD1 and the second pads PD2 are disposed adjacent to thesecond ends of the sensor columns TSC. Since the first pads PD1 and thesecond pads PD2 are arranged in association with the same side of thenon-display area NDR, a bonding process of the touch sensing unit 400and the second circuit board 400-F may be simplified. The third pads PD3may be arranged in association with the side of the non-display area NDRthat the first and second pads PD1 and PD2 are disposed.

The third signal line SL3 connects a j-th (j being a natural numbergreater than or equal to 1 and less than or equal to i) second sensor TPamong the i second sensors TPi of a n-th sensor block of the sensorblocks SB of each of the sensor columns TSC1 to TSC4 and an (i-j+1)-thsecond sensor among the i second sensors TPi of an (n+1)-th sensor blockof the sensor blocks SB of each of the sensor columns TSC1 to TSC4.Hereinafter, three third signal lines SL3-1, SL3-2, and SL3-3 will bedescribed in more detail.

One third signal line SL3-1 connects a first second sensor TP of a firstsensor block SB, a third second sensor TP of a second sensor block SB, afirst second sensor TP of a third sensor block SB, and a third secondsensor TP of a fourth sensor block SB. Another third signal line SL3-2connects second second sensors TP of the first to fourth sensor blocksSB. Yet another third signal line SL3-3 connects a third second sensorTP of the first sensor block SB, a first second sensor TP of the secondsensor block SB, a third second sensor TP of the third sensor block SB,and a first second sensor TP of the fourth sensor block SB. The thirdsignal lines SL3 connect the second sensors TP of the sensor columnsTSC, and second ends thereof are connected to the third pad PD3.

The first sensors RP, the second sensors TP, the first signal lines SL1,the second signal lines SL2, the third signal lines SL3, the first padsPD1, the second pads PD2, and the third pads PD3 may be disposed on thesame layer as one another. At least the first and second sensors RP andTP may be formed by patterning a conductive layer formed through thesame process. At least the first, second, and third signal lines SL1,SL2, and SL3 may be formed by to patterning a conductive layer formedthrough the same process. At least the first, second, and third padsPD1, PD2, and PD3 may be formed by patterning a conductive layer formedthrough the same process and formed by patterning a conductive layerformed through the same process as the first, second, and third signallines SL1, SL2, and SL3.

FIGS. 7B and 7C show two sensor blocks SB adjacent to each other anddisposed in the fourth sensor row TSL4. In FIG. 7B, two signal lines aredisposed between sensor blocks SB1 and SB2, and four signal lines aredisposed between sensor blocks SB10 and SB20 in FIG. 7C. The number ofthe signal lines SL disposed between the first sensor RP and the secondsensors TP is reduced in the touch sensing unit according to one or moreexemplary embodiments when compared with the touch sensing unitaccording to the comparative example. Accordingly, a noise exertinginfluence on electrostatic capacitance formed in association with thefirst sensor RP and the second sensors TP may be reduced.

FIG. 8 is an enlarged plan view of a second circuit board of the touchsensing unit of FIG. 5, according to one or more exemplary embodiments.Hereinafter, the second circuit board 400-F will be described in moredetail with reference to FIGS. 5, 7A, and 8.

The second circuit board 400-F includes at least one insulating layerand a plurality of conductive layers. The conductive layers arepatterned by a photolithography process, and, as such, a plurality ofpads (hereinafter, referred to as substrate pads) and a plurality ofsignal lines (hereinafter, referred to as substrate signal lines) areformed. Each of the conductive layers includes the substrate signallines. A portion of the conductive layers includes pads. Signal linesdisposed on different layers are electrically connected to each otherthrough contact holes formed through at least one insulating layer. FIG.8 mainly shows a connection relation between the substrate pads and thesubstrate signal lines.

The substrate pads may further include first substrate pads PDF1electrically connected to the first pads PD1 (refer to FIG. 7A), secondsubstrate pads PDF2 electrically connected to the second pads PD2 (referto FIG. 7A), and third substrate pads PDF3 electrically connected to thethird pads PD3 (refer to FIG. 7A). The substrate pads may furtherinclude fourth substrate pads PDF4 connected to the driving circuit400-IC.

The substrate signal lines may include first substrate signal lines SLF1connected to the first substrate pads PDF1, second substrate signallines SLF2 connected to the second substrate pads PDF2, and thirdsubstrate signal lines SLF3 connected to the third substrate pads PDF3.In addition, the substrate signal lines may further include fourthsubstrate signal lines SLF4 electrically connecting corresponding firstsubstrate signal lines SLF1 to each other and corresponding secondsubstrate signal lines SLF2 to each other. In addition, the substratesignal lines may also include fifth substrate signal lines SLF5 toconnect the fourth substrate signal lines SLF4 to the driving circuit400-IC. Further, the substrate signal lines may further include sixthsubstrate signal lines SLF6 to connect the driving circuit 400-IC to thefourth substrate pads PDF4. According to one or more exemplaryembodiments, the fourth substrate signal lines SLF4 are distinct fromthe fifth substrate signal lines SLF5, but the fourth and fifthsubstrate signal lines SLF4 and SLF5, which are connected to each other,may be referred to as one signal line.

Hereinafter, the electrical connection relation of the sensor columnsTSC will be described in detail with reference to FIGS. 7A and 8. Fordescriptive convenience, the first sensor column TSC and the secondsensor column TSC2 shown in FIG. 7A will be mainly described asexemplary of the other sensor columns TSC.

The first sensor RP of the n-th sensor block SB of the first sensorcolumn TSC1 is electrically connected to the first sensor RP of the n-thsensor block SB of the second sensor column TSC2. That is, the firstsensors RP arranged in the same sensor row TSL, but different sensorcolumns TSC are electrically connected to each other. The first sensorRP of the first sensor block SB of the first sensor row TSL1 iselectrically connected to the first sensor RP of the second sensor blockSB of the first sensor row TSL1. The first pads PD1-1 connected to twofirst sensors RP of the first sensor row TSL1 shown in FIG. 7A arerespectively connected to two first substrate pads PDF1-1 shown in FIG.8. The two first substrate pads PDF1-1 are electrically connected to thefirst substrate signal lines SLF1 through one fourth substrate signalline SLF4-1 of the fourth substrate signal lines SLF4. In addition, thefourth substrate signal line SLF4-1 is connected to the driving circuit400-IC through one fifth substrate signal line SLF5-1 of the fifthsubstrate signal lines SLF5. Consequently, the first sensor RP of thefirst sensor block 513 of the first sensor row TSL1 and the first sensorRP of the second sensor block SB of the first sensor row TSL1 mayreceive the same signal from the driving circuit 400-IC. According toone or more exemplary embodiments, the first sensor RP of the firstsensor block SB of the fourth sensor row TSL4 is electrically connectedto the first sensor RP of the second sensor block SB of the fourthsensor row TSL4. The second pads PD2-2 connected to two first sensors RPof the fourth sensor row TSL4 shown in FIG. 7A are respectivelyconnected to two second substrate pads PDF2-2 shown in FIG. 8.

The two second substrate pads PDF2-2 are electrically connected to eachother through the second substrate signal lines SLF2 and one fourthsignal line SLF4-4 of the fourth substrate signal lines SLF4. Inaddition, the one fourth signal line SLF4-4 is connected to the drivingcircuit 400-IC through one fifth substrate signal line SLF5-4 of thefifth substrate signal lines SLF5. In this manner, the first sensor RPof the first sensor block SB of the fourth sensor row TSL4 and the firstsensor RP of the second sensor block SB of the fourth sensor row TSL4may receive the same signal from the driving circuit 400-IC.

According to one or more exemplary embodiments, the first sensors RPcorresponding to each other among the first sensors RP arranged indifferent sensor columns TSC are electrically connected to each other,but the second sensors TP arranged in different sensor columns TSC areelectrically insulated from each other. The third pads PD3 shown in FIG.7A are connected to the third substrate pads PDF3 shown in FIG. 8 inone-to-one correspondence. Each of the third substrate signal lines SLF3connects a corresponding third substrate pad of the third substrate padsPDF3 to the driving circuit 400-IC. In this manner, the first secondsensor TP of the first sensor block SB of the first sensor row TSL1 andthe first second sensor TP of the second sensor block SB of the firstsensor row TSL1 may receive different signals from one another from thedriving circuit 400-IC.

The driving circuit 400-IC generates transmission (hereinafter, referredto as “Tx”) signals to drive the touch sensing unit 400. The Tx signalsmay be alternating current signals applied to the sensors astransmission signals. In addition, the driving circuit IC calculates (orotherwise determines) the coordinate information of the position atwhich the touch event occurs, from received (hereinafter, referred to as“Rx”) signals from the touch sensing unit 400. The Rx signals may bealternating current signals obtained from the Tx signals changed byexternal input. The Tx signals may be referred to as first signals andthe Rx signals may be referred to as second signals.

Although not shown in detail in the figures, first ends of the sixthsubstrate signal lines SLF6 are respectively connected to the pads ofthe driving circuit 400-IC Second ends of the sixth substrate signallines SLF6 are respectively connected to the fourth substrate pads PDF4.The second circuit board 400-F may be electrically connected to theother circuit board to or an electronic component, such as a connector,through the fourth substrate pads PDF4. The second circuit board 400-Fmay receive control signals from a central control circuit disposed onthe other circuit board through the fourth substrate pads PDF4 to drivethe touch sensing unit 400. The control signals to drive the touchsensing unit 400 may be, but are not limited to, signals to control ascan driving circuit 410, a touch sensing circuit 420, and a switchingcircuit 430, which will be described in more detail with reference toFIGS. 9A and 9B.

FIGS. 9A and 9B are block diagrams of a driving circuit of a touchsensing unit, according to one or more exemplary embodiments. Thedriving circuit may be driving circuit 400-IC1 and/or 400-IC10.Hereinafter, the driving circuits 400-IC1 and 400-IC10 of the touchsensing unit will be described in more detail.

Referring to FIG. 9A, the driving circuit 400-IC1 may include the scandriving circuit 410 generating the Tx signals Tx-S and the touch sensingcircuit 420 calculating (or otherwise determining) the coordinateinformation of the position at which a touch event occurs, from the Rxsignals Rx-S. The Tx signals Tx-S are applied to one sensor of the firstsensors RP (refer to FIG. 7A) and the second sensors TP (refer to FIG.7A) through a portion of the substrate signal lines SLF1 to SLF5 of thesecond circuit board 400-F. The Rx signals Rx-S are applied to the touchsensing circuit 420 through the portion of the substrate signal linesSLF1 to SLF5 of the second circuit, board 400-F from the other sensorsof the first sensors RP and the second sensors TP. According to one ormore exemplary embodiments, the coordinate information of the positionat which the touch event occurs may be obtained by a mutual capacitancemanner.

Hereinafter, the Tx signals Tx-S applied to the second sensors TP willbe described. The Tx signals Tx-S output from the scan driving circuit410 are applied to the second sensors TP through the third substratesignal lines SLF3, the third substrate pads PDF3, the third pads PD3,and the third signal lines SL3. The scan driving circuit 410 applies theTx signals Tx-S having different information from each other to thesecond sensors TR The Tx signals Tx-S are alternating current signals.Here, the expression that the Tx signals Tx-S have different informationmeans that the Tx signals Tx-S have different time information,different frequency information, and/or different code information. TheTx signals Tx-S modulated by is time division multiple access areactivated with different time periods from each other. For instance,periods in which the Tx signals Tx-S have a high level are differentfrom each other. The Tx signals Tx-S modulated by frequency divisionmultiple access have different frequencies from each other. The Txsignals Tx-S modulated by code division multiple access have differentcode information from each other.

The first sensor RP is capacitively coupled to the second sensor TPadjacent to the first sensor RP by the Tx signals Tx-S applied to thesecond sensors TP (refer to FIG. 7A). For instance, when an input memberis disposed on the first and second sensors RP and TP, which arecapacitively coupled to each other, a capacitance between the first andsecond sensors RP and TP varies. The touch sensing circuit 420 sensesthe variation of the capacitance to calculate the coordinate informationof the input member. For instance, the touch sensing circuit 420 mayinclude an amplifier, a noise filter, and an analog-to-digitalconverter. The amplifier amplifies the Rx signals Rx-S applied thereto.The noise filter removes noise from the amplified Rx signals Rx-S. Theanalog-to-digital converter converts the Rx signals Rx-S, from which thenoise is removed, to digital signals. The coordinate information of theposition, at which the touch event occurs may be calculated from thedigital signals.

Referring to FIG. 9B, the driving circuit 400-IC10 may include the scandriving circuit 410, the touch sensing circuit 420, and the switchingcircuit 430. According to one or more exemplary embodiments, thecoordinate information of the position at which the touch event occursmay be obtained by a self-capacitance manner or a mutual capacitancemanner.

The switching circuit 430 selectively connects the scan driving circuit410 and the touch sensing circuit 420 to the first and second pads PD1and PD2. (refer to FIG. 7A) or the third pads PD3 (refer to FIG. 7A).Accordingly, the Tx signals Tx-S may be selectively applied to the firstsensors RP (refer to FIG. 7A) and the second sensors TP (refer to FIG.7A). The switching circuit 430 includes, for instance, a first switchSE1 and a second switch SE2. As seen in FIG. 9B, the switching circuit430 includes one first switch SE1 and one second switch SE2, but thenumber of the first and second switches SE1 and SE2 are determineddepending on the number of the sensor columns, the sub-columns, and thesensor rows. The method of obtaining the coordinate information of theinput position using the mutual capacitance manner is the same asdescribed with reference to FIG. 9A. To obtain the coordinateinformation of the input position using the self-capacitance manner, theTx signals Tx-S may be applied to each of the first sensors RP and thesecond sensors TP. The coordinate information of the input position maybe obtained by sensing the variation of the capacitance occurring in thesensors to which the Tx signals Tx-S are applied.

FIGS. 10A, 10B, 10C, and 10D are enlarged plan views of touch sensingunits, according to one or more exemplary embodiments. Hereinafter, thetouch sensing units 400-1 to 400-3 will be described in more detail withreference to FIGS. 10A to 10C. In FIGS. 10A to 10D, detaileddescriptions of the same elements as those in FIGS. 1 to 9B will beomitted to avoid redundancy and obscuring exemplary embodimentsdescribed herein.

The touch sensing units 400-1 to 400-3 shown in FIGS. 10A to 10C havethe same structure and function as the touch sensing unit 400 shown inFIG. 7B except for an icy arrangement of the first and second signallines SL1 and SL2. As shown in FIG. 10A, each of the first signal linesSL1 connected to the first sensor RP of the first sensor block SB andthe second signal line SL2 connected to the first sensor RP of thefourth sensor block SB is disposed at a right side of the correspondingfirst sensor RP in the sensor columns TSC. As seen in FIG. 10B, thefirst signal lines SL1 may be respectively connected to the first sensorRP of the first is sensor block SB and the first sensor RP of the thirdsensor block SB in the sensor columns TSC. As seen in FIG. 10C, thesecond signal lines SL2 may be respectively connected to the firstsensors RP of the second sensor block SB to the fourth sensor block SBin the sensor columns TSC. To this end, the first signal lines SL1 areconnected to the first sensor RP of the first sensor block SB in thesensor columns TSC. The touch sensing unit 400-4 shown in FIG. 10Dfurther includes floated dummy patterns DMP different from the touchsensing unit 400 shown in FIG. 7B. The dummy patterns DMP include thesame material as the first sensors RP and/or the second sensors TP. Thedummy patterns DMP compensate for an optical efficiency, e.g., arefractive index or a reflectance, of areas of the display area DR inwhich the first and second sensors RP and TP are not disposed.

FIG. 11A is a plan view of a touch sensing unit, according to one ormore exemplary embodiments, FIG. 11B is an enlarged plan view of thetouch sensing unit of FIG. 11A, according to one or more exemplaryembodiments. FIG. 12A is a plan view of a touch sensing unit, accordingto one or more exemplary embodiments. FIG. 12B is an enlarged plan viewof the touch sensing unit of FIG. 12A, according to one or moreexemplary embodiments. Hereinafter, the touch sensing units 400-5 and400-6 will be described in detail with reference to FIGS. 11A, 11B, 12A,and 12B. In FIGS. 11A to 12B, detailed descriptions of the same elementsas those in FIGS. 1 to 10D will be omitted to avoid redundancy and avoidobscuring exemplary embodiments described herein.

Referring to FIGS. 11A and 11B, the driving circuit 400-IC may bemounted on the non-display area NDR of the touch sensing unit 400-5. Thetouch sensing unit 400-5 has different layer structures in accordancewith the display area DR and the non-display area NDR. For instance, oneconductive layer is disposed in the display area DR and conductivelayers and insulating layers are disposed in the non-display area NDR.Since the first sensors RP are not overlapped with the second sensorsTP, the conductive layer is formed in the display area DR in asingle-layer structure. Since the first to third signal lines SL1 to SL3do not cross each other, the conductive layer is formed in the displayarea DR in the single-layer structure. In this manner, the elements inthe display area. DR are formed by patterning the conductive layers,each having the single-layer structure.

Fourth signal lines SL4 and fifth signal lines SL5 respectivelycorresponding to the fourth substrate signal lines SLF4 and the fifthsubstrate signal lines SLF5 described with reference to FIG. 8 aredisposed in the non-display area NDR of touch sensing unit 400-5.According to one or more exemplary embodiments, the fourth signal linesSL4 are distinct from the fifth signal lines SL5, but the fourth andfifth signal lines SL4 and SL5, which are connected to each other, maybe referred to as one signal line. Since the first and second signallines SL1 and SL2 may be directly connected to the fourth signal linesSL4, the first and second substrate signal lines SLF1 and SLF2 shown inFIG. 8 may be omitted.

The driving circuit 400-IC is connected to the third signal lines SL3and the fifth signal lines SL5. According to one or more exemplaryembodiments, some pad groups among the pad groups shown in FIGS. 7A and8 may be omitted. Input/output pads PD-IO corresponding to the fourthsubstrate pads PDF4 in FIG. 8 are disposed on the touch sensing unit400-5 in FIG. 11B. The driving circuit 400-IC and the input/output padsPD-IO are connected to each other by sixth signal lines SL6. Althoughnot shown, the second circuit board 400-F10 may include substrate padsconnected to the input/output pads PD-IO of the touch sensing unit 400-5and substrate signal lines connected to the substrate pads. The secondcircuit board 400-F10 may be connected to one or more electroniccomponents, e.g., another circuit board or connector

Referring to FIGS. 12A and 12B, the driving circuit 400-IC may bedisposed on the other circuit board 400-M. The touch sensing unit 400-6may not include the driving circuit 400-IC, the sixth signal lines SL6,and the input/output pads PD-K) when compared with the touch sensingunit 400-5 described with reference to FIGS. 11A and 11B. Although notshown, a second circuit board 400-F20 may include substrate signallines, input substrate pads connected to first ends of the substratesignal lines and corresponding to the first to third pads PD1 to PD3,and output substrate pads connected to second ends of the substratesignal lines.

FIG. 13 is an enlarged cross-sectional view of a display panel,according to one or more exemplary embodiments. FIG. 14 is a plan viewof the display panel of FIG. 13, according to one or more exemplaryembodiments. FIG. 15 is an equivalent circuit diagram of a pixel,according to one or more exemplary embodiments. Hereinafter, the displaypanel 300 will be described in more detail with reference to FIGS. 13 to15. In FIGS. 13 to 15, detailed descriptions of the same elements asthose in FIGS. 1 to 12B will be omitted to avoid redundancy andobscuring exemplary embodiments described herein.

Referring to FIG. 13, the display panel 300 includes a base member300-BS, a circuit layer 300-CL, an element layer 300-EL, and anencapsulation layer 300-ECL. Although not shown, the display panel 300may further include an optical member disposed on the encapsulationlayer 300-ECL, e g., a phase retardation plate, a polarizing plate, etc.

The base member 300-BS may include at least one plastic film. The basemember 300-BS may include two plastic films and inorganic layersdisposed between the two plastic films, e.g., at least one siliconnitride thin film layer and/or at least one silicon oxide thin filmlayer. The base member 300-BS may include at least one of polyimide(PI), polyethylenenaphthalate (PEN), polyethersulphone (PES), and fiberreinforced plastics (FRP).

The circuit layer 300-CL includes a plurality of signal lines SGLdisposed on the display panel 300 and electronic elements disposed onthe display panel 300. In addition, the circuit layer 300-CL includes aplurality of insulating layers to insulate the signal lines SGL from theelectronic elements.

Referring to FIGS. 14 and 15, the circuit layer 300-CL includes thesignal lines SGL. The signal lines SGL include gate lines GL extendingin the first direction DR1 and data lines DL extending in the seconddirection DR2. Each of the gate lines GL and each of the data lines DLare connected to a corresponding pixel of the pixels PX. The circuitlayer 300-CL includes circuits of the pixel PX, e.g., at least one thinfilm transistor (such as first and second thin film transistors TFT1 andTFT2) and at least one capacitor (such as capacitor Cap). The circuitlayer 300-CL may further include a gate driving circuit DCV disposed at(or near) a side of the non-display area NDR. The gate lines GL and thedata lines DL include a gate pad part GL-P and data pad parts DL-P,respectively, that are disposed in the non-display area NDR. The gatepad part GL-P and the data pad parts DL-P are connected to the firstcircuit board 300-F. The display panel 300 is connected to a maindriving circuit through the first circuit board 300-F.

The element layer 300-EL includes display elements. As shown in FIGS. 14and 15, the element layer 300-EL includes an organic light emittingdiode OLED of the pixel PX. The element layer 300-EL may further includeone or more electronic elements to assist the to organic light emittingdiode OLED. The encapsulation layer 300-ECL encapsulates the elementlayer 300-EL. The element layer 300-EL includes a thin filmencapsulation layer, e.g., a plurality of inorganic thin film layers anda plurality of organic thin film layers. According to one or moreexemplary embodiments, the encapsulation layer 300-ECL may be replacedwith an encapsulation substrate. The encapsulation substrate may bedisposed over, and, thereby, spaced apart from the base member 300-BSsuch that the element layer 300-EL is disposed between the encapsulationsubstrate and the base member 300-BS. To this end, a sealant may beprovided along an edge of the encapsulation substrate and the basemember 300-BS to form a space.

According to one or more exemplary embodiments, the base member 400-BS(refer to FIG. 4) of the touch sensing unit 400 may be disposed on theencapsulation layer 300-ECL or the encapsulation substrate. Further, theconductive layer 400-CL (refer to FIG. 4) of the touch sensing unit 400may be directly disposed on the encapsulation layer 300-ECL or theencapsulation substrate. That is, the encapsulation layer 300-ECL or theencapsulation substrate may provide a base surface on which the firstand second sensors RP and TP are disposed. In addition, the first andsecond sensors RP and TP may be directly disposed on the otherfunctional layer, e.g., an insulating layer, a refractive index controllayer, etc., disposed on the surface of the encapsulation layer 300-ECLor the encapsulation substrate. Further, the encapsulation layer 300-ECLincluding thin film layers, and one layer of the thin film layers mayserve as the base surface. For instance, the first and second sensors RPand TP may be disposed on one inorganic layer. The inorganic layer orthe organic layer may be stacked on the inorganic layer serving as thebase surface.

FIG. 16 is a plan view of a touch sensing unit, according to one or moreexemplary embodiments. FIG. 17 is an enlarged plan view showing thetouch sensing unit of FIG. 16, according to one or more exemplaryembodiments. FIG. 18 is an enlarged plan view of a first circuit boardof the touch sensing unit of FIG. 17, according to one or more exemplaryembodiments. FIG. 19 is an enlarged plan view of a second circuit boardof the touch sensing unit of FIG. 17, according to one or more exemplaryembodiments. Hereinafter, the touch sensing unit 400-7 will be describedin more detail with reference to FIGS. 16 to 19. In FIGS. 16 to 19,detailed descriptions of the same elements as those in FIGS. 1 to 15will be omitted to avoid redundancy and obscuring exemplary embodimentsdescribed herein.

The touch sensing unit 400-7 includes a plurality of sensor blocks SBarranged in the display area DR. The first type circuit board 400-FT1and the second type circuit board 400-FT2 are bonded to the non-displayarea NDR of the touch sensing unit 400-7. Different from the touchsensing unit 400 shown in FIG. 7A, the touch sensing unit 400-7 furtherincludes fourth signal lines SL4. Fourth pads PD4 are connected to firstends of the fourth signal lines SL4 and fifth pads PD5 are connected tosecond ends of the fourth signal lines SL4. In addition, the first padsPD1 and the second pads PD2 are disposed in different areas from eachother in the non-display area NDR. The first pads PD1 are disposedadjacent to upper ends of the sensor columns TSC1 to TSC4 and the secondpads PD2 are disposed adjacent to lower ends of the sensor columns TSC1to TSC4. The first signal lines SL1 may include only the first portionLP1 of the first signal lines SL1.

The first type circuit board 400-FT1 may be substantially the same asthe circuit board 400-F shown in FIG. 8. The first type circuit board400-FT1 includes the first substrate pads PDF1, but the number of thefirst substrate pads PDF1 included in the first type circuit board400-FTI is smaller than that of the circuit board 400-F. The second typecircuit board 400-FT2 electrically connects the first sensors RPcorresponding to the sensor columns TSC to one another. In addition, thesecond type circuit board 400-F2 electrically connects the first padsPD1 and the fourth pads PD4 to one another.

As seen in FIG. 19, the second type circuit board 400-FT2 includes firstsubstrate pads PDT1 respectively electrically connected to the firstpads PD1, second substrate pads PDT2 respectively electrically connectedto the fourth pads PD4, and first and second substrate signal lines SLT1and SLT2. A first substrate signal line SLT1 electrically connects firstpads PDT1-1 of the first substrate pads PDT1 to a second substrate padPDT2-1 of the second substrate pads PDT2. A second substrate signal lineSLT2 electrically connects second pads PDT1-2 of the first substratepads PDT1 to another second substrate pad PDT2-2 of the second substratepads PDT2. The first substrate signal line SLT1 electrically connectsthe first sensors RP of the first sensor row TSL1 each other. A secondsubstrate signal line SLT2 electrically connects the first sensors RP ofthe second sensor row TSL2 each other.

FIG. 20 is a plan view of a touch sensing unit, according to one or moreexemplary embodiments. FIG. 21 is an enlarged plan view of a circuitboard, according to one or more exemplary embodiments. FIG. 22 is a planview of a touch sensing unit, according to one or more exemplaryembodiments. FIG. 23 is an enlarged plan view of a circuit board,according to one or more exemplary embodiments. Hereinafter, the touchsensing units 400-8 and 400-9 will be described in more detail withreference to FIGS. 20 to 23. In FIGS. 20 to 23, detailed descriptions ofthe same elements as those in FIGS. 1 to 19 will be omitted to avoidredundancy and obscuring exemplary embodiments described herein.

Referring to FIG. 20, a portion of the first sensors RP includes a firstsensor portion RP-1 and a second sensor portion RP-2 spaced apart fromthe first sensor portion RP-1. In accordance with a first sensor columnTSC1, the first sensors RP of the first and fourth sensor to blocks SBinclude two sensor portions RP-1 and RP-2. The two sensor portions RP-1and RP-2 are spaced apart from each other in the first direction DR1. Inthis manner, a portion of the first signal line SL1 connected to thefirst sensor RP of the second sensor block SB is disposed between thefirst sensor portion RP-1 of the first sensor block SB and the secondsensor portion RP-2 of the first sensor block SB. A portion of thesecond signal line SL2 connected to the first is sensor RP of the thirdsensor block SB is disposed between the first sensor portion RP-1 of thefourth sensor block and the second sensor portion RP-2 of the fourthsensor block.

According to one or more exemplary embodiments, the first signal lineSL1 connected to the first sensor RP of the second sensor block SB maynot be disposed between the first sensor RP and the second sensors TP ofthe first sensor block SB. The second signal line SL2 connected to thefirst sensor RP of the third sensor block SB may not be disposed betweenthe first sensor RP and the second sensors TP of the fourth sensorblock. Since the number of signal lines disposed between the firstsensor RP and the second sensors TP is reduced, noise exerting influenceon the capacitance formed by the first sensor RP and the second sensorsTP may be reduced.

The circuit board 400-F shown in FIG. 21 may have the same structure andfunction as those of the circuit board 400-F shown in FIG. 8 except forfirst substrate pads PDF1, first substrate signal lines SLF1, secondsubstrate pads PDF2, and second substrate signal lines SLF2. That is,the number of each of the first substrate pads PDF1, the first substratesignal lines SLF1, the second substrate pads PDF2, and the secondsubstrate signal lines SLF2 of the circuit board 400-F is increased.

As shown in FIG. 22, a portion of the first sensors RP includes a firstsensor portion RP-1 and a second sensor portion RP-2 spaced apart fromthe first sensor portion RP-1. In accordance with the first sensorcolumn TSC1, the first sensors RP of the second to fourth sensor blocksSB include two sensor portions RP-1 and RP-2. The two sensor portionsRP-1 and RP-2 are spaced apart from each other in the first directionDR1. In this manner, the second signal line SL2 connected to the firstsensor RP of the first sensor block SB is consecutively arranged betweenthe first and second sensor portions RP-1 and RP-2 of the second tofourth is sensor blocks SB. The second signal lines SL2 connected to thefirst and second sensor portions RP-1 and RP-2 of the second sensorblock SB are consecutively arranged between the first and second sensorportions RP-1 and RP-2 of the third and fourth sensor blocks SB.

According to one or more exemplary embodiments, the first signal linesSL1 and the first pads PD1 shown in FIG. 7A are omitted. Since thenumber of the signal lines disposed between the first sensor RP and thesecond sensors TP is reduced, noise exerting influence on thecapacitance formed between the first sensor RP and the second sensors TPmay be reduced.

The circuit board 400-F shown in FIG. 23 does not include the firstsubstrate pads PDF1 and the first substrate signal lines SLF1, which isdifferent from the circuit board 400-F shown in FIG. 8. In addition, thenumber of the second substrate pads PDF2 and the second substrate signallines SLF2 is increased. The circuit board 400-F shown in FIG. 23 mayhave the same structure and function as those of the circuit board 400-Fof FIG. 8 except for the aforementioned differences.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concept is not limitedto such embodiments, but rather to the broader scope of the presentedclaims and various obvious modifications and equivalent arrangements.

What is claimed is:
 1. A display device comprising: a display panel; anda touch sensing unit on the display panel, the touch sensing unitcomprising touch signal lines and sensor columns comprising k (k being anatural number greater than or equal to three) sensor blocks arranged ina first direction, wherein each of the k sensor blocks comprises: afirst sensor; and (i being a natural number greater than or equal tothree) second sensors arranged in the first direction, wherein the touchsignal lines comprise: first signal lines respectively connected to thefirst sensors; and second signal lines comprising first portions andsecond portions spaced apart from the first portions, wherein the firstportions connect a j-th (j being a natural number greater than or equalto is one and less than or equal to i) second sensor of the i secondsensors of an nth (n being a natural number greater than or equal toone) sensor block of the k sensor blocks to an (i-j+1)-th second sensorof the i second sensors of an (n+1)-th sensor block of the k sensorblocks, wherein the second portions connect a j-th second sensor of thei second sensors of the n+1)-th sensor block of the k sensors blocks toan (i-j+1)-th second sensor of the i second sensors of an (n+2)-thsensor block of the k sensor blocks, wherein the first portions aredisposed at one side of the i second sensors of the n-th sensor blockand the i second sensors of the (n+1)-th sensor block, and wherein thesecond portions are disposed at another one side of the i second sensorsof the (n+1)-th sensor block and the i second sensors of the (n+2)-thsensor block, the one side being different from the another one side.